Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials

Guo Feng; Li wei-jian; Yan liang-ming

doi:doi:10.11648/j.sd.20160401.20

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Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials

Guo Feng, Li wei-jian, Yan liang-ming

Published in Science Discovery (Volume 4, Issue 1)

Received: 22 April 2016 Published: 4 May 2016

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Abstract

In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.

Published in	Science Discovery (Volume 4, Issue 1)
DOI	10.11648/j.sd.20160401.20
Page(s)	56-60
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2016. Published by Science Publishing Group

Keywords

Soft Magnetic Powder, Insulation Resistance, Coated

References

[1]	贾梦秋，邓海峰．耐高温有机硅树脂的合成 [J]．化工新型材料.2007，35(7):46．
[2]	WANG Wen-juan, HU Jing. Study on Properties of Silicone-modified Water-borne Polyurethane [J] Int. J. Powder Meta lurgy, 2012, 31 (1): 9.
[3]	洪旭辉,李亚峰.氰酸酯改性环氧树脂耐热性研究[J].热固性树脂,2009,24(5):14-16。
[4]	王旭东.环氧树脂改性氰酸酯体系研究[J].工程塑料应用,2006,34(7):13-15。
[5]	邱军，黄裕杰，胡友慧．耐高温梯形聚甲基倍半硅氧烷的合成研究[J]．功能高分子学报．1999，12(2):173-176。
[6]	W Kowbe．CVD and CVR Silicone-based Functional Gradient Coatings on C-C Composite[J]．Carbon，2012，33(4): 41-42．
[7]	S.Garin，L.Lecamp. New Polysiloxane Bearing Heterocyclic Groups-systhesis and Curability[J]．European Polymer Journal．2014，35: 473-482．
[8]	F.H.James. High Temperature Coating From Space. Modern Paint and Coatings [J] 2008，(10): 131-132．
[9]	程斌等.热固性树脂的制备工艺[J]．热固性树脂．2010，(3):7。
[10]	Hou S S，Yen-Pin Chung，Cheng-Kuang Chan，Ping-Lin Kuo．Curing behavior and characterization of epoxy-siloxane copolymer blended with diglycidyl ether ofbisphenol-A[J]．Polymer．2013，41(9), 3263-3272．
[11]	谭晓明，黄乃瑜，简永华等．高羟甲基含量硼酚醛树脂的合成及表征[J]．塑料工业．2014，29(4):6-8。

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APA Style

Guo Feng, Li wei-jian, Yan liang-ming. (2016). Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials. Science Discovery, 4(1), 56-60. https://doi.org/10.11648/j.sd.20160401.20

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ACS Style

Guo Feng; Li wei-jian; Yan liang-ming. Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials. Sci. Discov. 2016, 4(1), 56-60. doi: 10.11648/j.sd.20160401.20

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AMA Style

Guo Feng, Li wei-jian, Yan liang-ming. Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials. Sci Discov. 2016;4(1):56-60. doi: 10.11648/j.sd.20160401.20

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@article{10.11648/j.sd.20160401.20,
  author = {Guo Feng and Li wei-jian and Yan liang-ming},
  title = {Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials},
  journal = {Science Discovery},
  volume = {4},
  number = {1},
  pages = {56-60},
  doi = {10.11648/j.sd.20160401.20},
  url = {https://doi.org/10.11648/j.sd.20160401.20},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.sd.20160401.20},
  abstract = {In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.},
 year = {2016}
}

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TY  - JOUR
T1  - Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials
AU  - Guo Feng
AU  - Li wei-jian
AU  - Yan liang-ming
Y1  - 2016/05/04
PY  - 2016
N1  - https://doi.org/10.11648/j.sd.20160401.20
DO  - 10.11648/j.sd.20160401.20
T2  - Science Discovery
JF  - Science Discovery
JO  - Science Discovery
SP  - 56
EP  - 60
PB  - Science Publishing Group
SN  - 2331-0650
UR  - https://doi.org/10.11648/j.sd.20160401.20
AB  - In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.
VL  - 4
IS  - 1
ER  -

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Author Information

Guo Feng

Global Vision Trading Ltd, Kunshan City, Jiangsu Province, China
Li wei-jian

Global Vision Trading Ltd, Kunshan City, Jiangsu Province, China
Yan liang-ming

Material Science and Engineering College, Inner Mongolia University of Technology, Material Science and Engineering Institute, Hohhot, China

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APA Style

Guo Feng, Li wei-jian, Yan liang-ming. (2016). Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials. Science Discovery, 4(1), 56-60. https://doi.org/10.11648/j.sd.20160401.20

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ACS Style

Guo Feng; Li wei-jian; Yan liang-ming. Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials. Sci. Discov. 2016, 4(1), 56-60. doi: 10.11648/j.sd.20160401.20

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AMA Style

Guo Feng, Li wei-jian, Yan liang-ming. Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials. Sci Discov. 2016;4(1):56-60. doi: 10.11648/j.sd.20160401.20

Copy | Download

@article{10.11648/j.sd.20160401.20,
  author = {Guo Feng and Li wei-jian and Yan liang-ming},
  title = {Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials},
  journal = {Science Discovery},
  volume = {4},
  number = {1},
  pages = {56-60},
  doi = {10.11648/j.sd.20160401.20},
  url = {https://doi.org/10.11648/j.sd.20160401.20},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.sd.20160401.20},
  abstract = {In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.},
 year = {2016}
}

Copy | Download

TY  - JOUR
T1  - Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials
AU  - Guo Feng
AU  - Li wei-jian
AU  - Yan liang-ming
Y1  - 2016/05/04
PY  - 2016
N1  - https://doi.org/10.11648/j.sd.20160401.20
DO  - 10.11648/j.sd.20160401.20
T2  - Science Discovery
JF  - Science Discovery
JO  - Science Discovery
SP  - 56
EP  - 60
PB  - Science Publishing Group
SN  - 2331-0650
UR  - https://doi.org/10.11648/j.sd.20160401.20
AB  - In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.
VL  - 4
IS  - 1
ER  -

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